XC6SLX9-2CSG225I IC Programming Chip Automotive Defense Grade Devices

XC6SLX9-2CSG225I Programmable IC Chip Package 225-CSPBGA Automotive and Defense-grade devices

Product Listing: Programmable IC Chip - XC6SLX9-2CSG225I

Product Name: Programmable IC Chip - XC6SLX9-2CSG225I

Product Description: The Programmable IC Chip - XC6SLX9-2CSG225I is a high-performance and versatile integrated circuit designed for programmable logic applications. With its advanced features and compact form factor, it offers designers the flexibility to create innovative solutions for a wide range of electronic projects and systems.

Product Specifications:

• Model: XC6SLX9-2CSG225I
• Package Type: 225-pin Ceramic Ball Grid Array (CSG225)
• Manufacturer: Xilinx
• Operating Temperature: -40°C to 100°C
• Logic Cells: 9,152
• Maximum User I/O Pins: 125
• Block RAM: 352 Kbits
• DSP Slices: 16
• Clock Management Tiles: 1
• JTAG Boundary Scan Support: Yes
• Configuration Memory: Non-volatile SPI Flash
• Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage

Key Features:

• High-performance and compact programmable logic device
• Durable and reliable Ceramic Ball Grid Array (CSG225) package
• Efficient utilization of logic cells for various designs
• Adequate I/O pins for connectivity requirements
• Ample block RAM for data storage needs
• Dedicated DSP slices for signal processing tasks
• Clock management tiles for precise timing control
• JTAG boundary scan support for easy debugging and testing
• Non-volatile SPI Flash for configuration storage
• Wide operating temperature range for reliability
• Low power consumption for energy-efficient designs

Applications:

• Embedded systems and IoT devices
• Communication and networking equipment
• Industrial automation and control systems
• Consumer electronics and multimedia devices
• Medical equipment and instrumentation
• Automotive electronics
• Aerospace and defense systems
• Test and measurement instruments

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XC6SLX9-2CSG225I IC Programming Chip Automotive Defense Grade Devices Images